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Plasma Cleaner G1000

Plasma cleaner with a parallel plate method, optimal for cleaning bonding pads (improving bondability) and surface modification/hydrophilization (molding pretreatment).

G1000 / G500 is a system that utilizes the etching effect of gas plasma to clean the surface of objects under low-pressure conditions. By selecting the appropriate gas for your application (such as argon, oxygen, hydrogen + argon, etc.), it effectively removes not only organic but also inorganic contaminants. This system is ideal for improving bonding strength through the cleaning of bonding surfaces on HIC substrates and lead frames, as well as enhancing wettability through surface modification (hydrophilization).

  • Other semiconductor manufacturing equipment

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